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Sepna Chemical Technology Co., Ltd.
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Epoxy Adhesive
Showing 1 - 3 of 3, total 1 pages [First] [Previous] [Next] [Last]
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two part thermally conductive epoxy potting compound se2215
Specification: Part A--14 KG/Metal drum, Part B--1 KG/ Pot.
Detail: #Product Description SE2215 is two-component solvent-free room temperature curing epoxy potting adhesive with excellent adhesion and heat resistance. #Key Features 1. Good toughness, high hardness 2. Excellent adhesion, ...
2
high strength two part epoxy structural adhesive se2211
Specification: Part A--20 kg/Bucket, Part B--20kg/ Bucket; 620ml mixing tube
Detail: #Product Description SE2211 is a room temperature curing or heat curing epoxy structural adhesive. It has following properties after cured with mixture ratio 1:1 of weight. #Key Features 1. Resistance of moisture, polluti...
3
two part rtv epoxy potting compound se2202
Specification: Part A¡ª25 KG/Bucket, Part B¡ª5 KG/ Pot.
Detail: #Product Description SE2202 is two-component solvent-free type room temperature curing epoxy potting adhesive. #Key Features 1. Good toughness, high hardness 2. Excellent adhesion, anti-cracking property 3. Excellent el...
Showing 1 - 3 of 3, total 1 pages [First] [Previous] [Next] [Last]
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